Failure Analysis
Failure Analysis Engineer
负责金相切片、SEM / EDS 与断面分析，输出失效根因判定报告并提出改进建议…
Job description
Responsible for metallographic cross-sections, SEM / EDS and fracture surface analysis, producing failure root cause determination reports and improvement recommendations. Requirements: materials / microelectronics related major; cross-section or microscopic analysis experience.
Job responsibilities
- Handle failure analysis projects such as metallographic cross-sections, SEM / EDS, fracture surface analysis, X-Ray and microscopic FTIR
- Define the analysis path based on the failure symptoms described by the customer, deciding whether to start from appearance, electrical performance or structure
- Deliver failure root cause reports with clear images and criteria, plus improvement recommendations
- Collaborate with the PCB / PCBA testing line to translate analysis conclusions into specific process parameters
- Maintain analysis equipment and gradually build a library of typical failure patterns
Requirements
- Degree (bachelor or above) in materials, microelectronics, electronic packaging or physics
- Experience in metallographic cross-sectioning or microscopic analysis; able to prepare samples independently
- Reports clearly structured: symptoms → analysis → criteria → conclusions → recommendations
- Patient with details; never rushes sample preparation
Preferred qualifications
- Familiar with PCB-related standards such as IPC-A-600 and IPC-TM-650
- Analysis experience with CAF, ionic migration and electromigration
- Able to use Python or ImageJ for image measurement
What we offer
- Hands-on real projects; work on customer cases from day one, not odd jobs
- Open access to equipment and training resources, with someone to guide you through standard updates
- Assignment at either site based on proximity, with commuting subsidies for Shenzhen and Dongguan
- Dual-track career growth in technical and management roles, not based on seniority alone
Open Roles
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