PCB / PCBA
For single/double-sided boards, multilayer boards, HDI and PCBA assemblies, we provide full-dimension testing and failure analysis: appearance, dimensions, plating, solderability, soldering quality and interlayer defects — locating problems and giving process improvement recommendations.
You are probably struggling with these issues
These are the things we hear most. If any of the following matches your situation, it is time for a systematic pre-compliance assessment.
Soldering defects (cold joints, solder bridges, voids) only surface at final assembly, doubling rework costs
Hidden risks such as interlayer cracking and CAF failure cannot be detected in advance
Returned boards from customer complaints cannot be root-caused, so entire batches are scrapped
What we do for this industry
Listed here by capability area; specific items are subject to the test plan.
- Appearance and structure: Visual inspection, dimensional measurement, warpage, board thickness and hole diameter
- Plating analysis: Plating thickness, plating composition, solderability, resistance to soldering heat
- Soldering Quality: Solder joint appearance, X-Ray void rate, cross-section metallography, BGA solder joints
- Electrical Performance: Continuity, insulation resistance, withstand voltage, impedance characteristics
- Reliability: Thermal shock, temperature-humidity cycling, ionic contamination, CAF / insulation degradation
- Assembly process: PCBA cleanliness, solder balls / residues, conformal coating inspection
- Failure Analysis: Cross-section metallography, SEM / EDS, fracture surface localization and root cause determination
Main applicable standards
Below are the standards most frequently required in this industry; the actual applicable items depend on the target market and customer requirements.
| Standard / Regulation | Content |
|---|---|
| IPC-A-600 / IPC-6012 | Acceptability of printed boards (rigid) |
| IPC-A-610 / IPC J-STD-001 | Acceptability of electronic assemblies and soldering requirements |
| GB/T 4677 / IPC-TM-650 | Test methods for printed boards |
| IPC-6012 / IPC-2221 | Qualification and design of rigid printed boards |
| IEC 60068-2-14 / GB/T 2423.22 | Temperature change (thermal shock) |
| IEC 61189 series | Test methods for electronic materials, printed boards and assemblies |
| J-STD-003 / J-STD-002 | Solderability of printed boards and components |
| IPC-TM-650 2.6.25 | Ionic contamination testing |
Standard versions are updated; please confirm the current valid version with us before formal submission.
Delivery Time
Appearance / dimensions / plating: 2~3 business days; cross-section metallography: 3~5 business days; full packages including X-Ray and ionic contamination: 5~7 business days.
Main capability areas
Appearance & Dimensions
Full items: appearance, warpage, board thickness, hole diameter
Plating & Solderability
Plating thickness and composition, solderability, resistance to soldering heat
Soldering Quality
X-Ray void rate, cross-section metallography, BGA solder joints
Electrical Performance
Continuity, insulation, withstand voltage, impedance characteristics
Reliability
Thermal shock, temperature-humidity cycling, ionic contamination
Failure Analysis
SEM / EDS, fracture surface localization, root cause determination
Which laboratories handle these capabilities
Click in to see the specific test item list and equipment models.
Finalize your test plan for PCB / PCBA
Our technical consultants select the minimum necessary test combination based on your target market and customer requirements, and deliver a plan and quotation within 1 business day.
