TMC200923101-C

星期三, 27 1月 2021 16:37

TMC200923101-C

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  • 证书号码/Declaration No.: TMC200923101-C
  • 申请商: Guangdong Huaguan Semiconductor Co., Ltd.
  • 申请商地址: 1A、1B, BUILDING,SAITU INDUSTRIAL PARK,NO 137 BULAN ROAD,BUJI STREET,LONGGANG DISTRICT,SHENZHEN,CHINA 518114
  • 制造商: Guangdong Huaguan Semiconductor Co., Ltd.
  • 制造商地址: 1A、1B, BUILDING,SAITU INDUSTRIAL PARK,NO 137 BULAN ROAD,BUJI STREET,LONGGANG DISTRICT,SHENZHEN,CHINA 518114
  • 产品名: TO SOP DIP
  • 额定参数: /
  • 型号名:

    TO263-5L, TO263-5L-001, TO263-5L-002, TO263-5L-003, TO220-5L,
    TO-220-5L-001 TO220-5L-002, TO220-5L-003, S-TO220B-5L ,
    TO-220B-5L, TO263-3L, TO220-3L, S-TO220-3L, TO263-2L, TO92,
    SOP8, SOP14, SOP16, SOP8-001, ESOP8, ESOP8-001 MSOP8
    SOP20, SSOP48, SOT23, SOT23-5, SOT223, SOT89,
    DIP8, DIP14, DIP16, DIP18, DIP20, DIP24, DIP40

  • 指令: RoHS 2.0 Directive (EU) 2015/863 and (EU)2017/2102 amending Annex II to Directive 2011/65/EU
  • 标准:

    IEC 62321-1:2013 IEC 62321-3-1:2013
    IEC 62321-4:2017 IEC 62321-5:2013
    IEC 62321:6-2015 IEC 62321-7-1:2015
    IEC 62321-7-2:2017 IEC 62321-8:2017

  • 核发日期: September 27, 2020
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